Glass Microwave Integrated Circuit (GMIC)
Glass Microwave Integrated Circuit (GMIC) is a novel circuit fabrication technology. It provides many advantages of GaAs MMICs whilst retaining the desirable performance characteristics of hybrid MICs. GMIC Offers:
- Excellent Microwave Performance
- Integrated Passive Elements – R, C, & L
- Accepts all types of active devices.
- Compatible with Auto Assembly & Test.
- Excellent Thermal Management
- Predictable performance in volume.
- Small Size and Low cost.
GMIC Applications – 900 MHz to 100 GHz
Versatility and Reliability:
- VCO's
- Amplifiers
- Mixers
- Control Devices
- Passive Components
- Sub Systems
For use in the following:
- Imaging Radar (Airport Body Scanners)
- Missile Frontend Assemblies
- AESE, Active Antenna components
GMIC technology is a wafer-level, photolithographic; batch process oriented manufacturing technology, in which a large number of circuits can be fabricated on each wafer. It comprises a thin glass substrate bonded to a high conductivity silicon carrier, forming a composite wafer with RF capacitors, inductors, conductors, air-bridges and plated via holes defined on the thin glass substrate.
Technology Comparison.
GMIC is an extremely reproducible fabrication technology capable of producing high performance microwave components for critical applications: the small number of wire bonds greatly enhances reliability. The great strength of GMIC is as an integration medium and as an enabling technology for MMIC.
