Hybrid Manufacture
Hybrid manufacture at Cobham MAL Ltd. is currently established for medium volume military and space requirements.
All parts are built with individual history, full batch traceability and 100% inspection at all stages. Standard sub-assemblies are normally built in batches for stock. Non-standard sub-assemblies are built specifically to job and integrated with any standard sub-assemblies to yield a total integrated assembly.
All processing up to and including laser seam weld sealing is carried out in class 10,000 clean room conditions. Storage of components and sub-assemblies is under the same clean room conditions with the additional provision of dry nitrogen atmospheres in storage cabinets to reduce long-term physio-chemical degradation effects. Extensive anti-static precautions are taken at all stages.
The process philosophy is for ‘all clean’ processing. Parts are received either internally or from outside vendors in a verified clean condition. All processes, whether involving organic or inorganic materials are performed without the use of any extraneous organics (e.g. fluxes) and all handling of parts is by tweezers to avoid finger grease contamination. The purpose of this is to eliminate all routine organic (i.e. solvent) cleaning processes because these are hazardous and frequently spread rather than remove contaminants.
Assemblies and sub-assemblies are built by operators; by the end of 2010 Cobham MAL Ltd. will have the capability for auto assembly and auto bonding. Integrated units are passed to the test area for test and tuning (manual or ATE). This is performed by technicians with workmanship assistance from the manufacturing operators where necessary. Supervision is by senior operators for assembly, engineering and test, reporting to the Manufacturing Manager. Technology auditing, troubleshooting and P.I.D. verification is the responsibility of Advanced Manufacturing.
Hybrid Assembly Processing
The Cobham MAL Ltd. hybrid assembly facility has equipment for die bonding; interconnect bonding, auto bonding, testing and sealing. Hybrid circuits are assembled with different techniques depending on the technology and materials used in the assembly.