Capabilities

Manufacturing

SAS-Lansdale provides a vertically integrated manufacturing capability for electronic subsystems and components that includes:

1. High complexity manufacturing of microwave and millimeter wave assemblies.
2. Microwave module assembly including automatic epoxy dispense, automatic die attach, automatic wire and ribbon bonding and laser sealing
3. MIL-STD-883 Screening
4. Vertically integrated manufacturing of complex electro-mechanical assemblies.
5. Automated/Semi-automated through-hole and surface mount component circuit card assembly manufacturing.
6. Reflow/Wave soldering, conformal coating, real time x-ray inspection capabilities.
7. Integration and assembly of RF, digital, high voltage, and high power assemblies.
8. Magnetics/Transformer capabilities including toroid, bobbin and flat, progressive and bank winding for inductors, chokes, power transformers, and high voltage multi-tap transformers.
9. CNC lathe, CNC machining centers, and tool & die capabilities with full support functions.
10. Dedicated antenna assembly area with custom tooling for high precision and repeatability.
11. On-site print and etch for spirals and baluns for cavity backed antennas.

Testing

SAS-Lansdale also provides a complete environmental test capability:

1. Climatic testing with over 40 environmental chambers.
2. Combined Temperature/Vibration test facilities to perform Environmental Stress Screening and Reliability Testing.
3. Vibration/Shock testing with 10 electrodynamic systems, 1 electro-hydraulic system, 1 vehicle transport simulator, and various other mechanical shock instruments.
4. Contaminant Environment including Explosive Atmosphere, Salt Fog, Windblown Dust, and Fluid Compatibility.

Complete test capabilities are provided for all components and subsystems to include:

1. Classified automated hybrid/microwave test capabilities.
2. Automated test of all levels of assembly (In-Circuit, Functional, Harness/DITMCO).
3. Antenna element and array testing
4. High power transmitter testing