Non magnetic square Melf package
The inside Chip is passive to ensure high reliability and very low leakage. These diodes ensure high power switching at frequencies from 1 MHz to several GHz. Packages are based on ceramic technology with low inductance and axial terminations. Design simplifies automatic pick and place indexing and assembly.
Terminations contacts are tin plated for vapour or reflow circuit board soldering. Active area is a PIN high power glass passive chip, which can be designed on Customer specifications.
Applications
Non-magnetic diodes are particularly suitable for Magnetic Resonance Imaging applications. The maximum operating breakdown voltage is 1200 V. Several values of total capacitance are available (from 0.40 pF); together with a low forward series resistance.
These devices are characterized for high power handling, low loss and low distortion (long carrier lifetime design). Electrical properties are ideal for use in RF coils which must produce a homogeneous electromagnetic field in the MRI system for frequencies from a few MHz to over few
100 MHz.
Package with axial leads are available on request.
Features
- Non magnetic package
- Low loss, low distortion
- Low inductance
- High reliability
- Hermetically sealed package
- Glass passive PIN diode chip
- Non rolling MELF design
- Pick and place compatibility
>>> learn more (pdf 1380kb)
- SMD4
- SMD6
- SMD8